哈尔滨工业大学化工与化学学院的甘阳教授课题组与机电学院的张飞虎教授合作，在原科技部973计划项目和国家自然科学基金委重点项目资助下，利用原子力显微镜进行单青蒿素颗粒的模拟抛光实验和表面形貌表征，发现青蒿素在纯水中就能氧化蚀刻LED用的超硬碳化硅衬底（莫氏硬度9.5，仅次于金刚石），其可能的机理是青蒿素中独特的过氧桥键在机械作用下，于水中释放出强氧化性的羟基自由基，从而分解了碳化硅。本研究结果也指出了一条利用结构特殊的软性有机晶体，在液相中释放出反应性基团，实现难加工硬脆材料的无污染、无划伤抛光加工的全新途径。（文章：Yu-rong Zhu, Dan Zhang, Fei-hu Zhang, Yang Gan, Marrying Medicine and Materials: Artemisinin (Qinghaosu) Particle is Soft Enough for Scratching Hard SiC Wafer in Water（融合医学和材料学：青蒿素以柔克刚在水中刻蚀坚硬的碳化硅）, ScienceOpen Research, 2016, 10.14293/S2199-1006.1.SOR-MATSCI.AMNMZS.v1）
论文摘要：Silicon carbide (SiC) single crystals, along with sapphire and silicon, are one of most important substrates for high-brightness LED fabrications. Owing to extremely high hardness (Mohs’ scale of 9.5) and chemical inertness, the polishing rate of SiC with conventional chemical mechanical polishing (CMP) methods is not high, and surface scratches are also inevitable because of using slurry containing hard abrasives such as silica particles. Here artemisinin (Qinghaosu) crystals, very soft molecular solids, were found, for the first time to the best of our knowledge, to effectively polish SiC wafers even in pure water as demonstrated by proof-of-concept scratching experiments using atomic force microscopy (AFM). The underlying mechanism is attributed to activated oxidation of SiC by mechanically released reactive ·OH free radicals from the endoperoxide bridges. The preliminary results reported here have important implications for developing novel alternative green and scratch-free polishing methods for hard-brittle substrates including SiC and others.